发明名称 |
LIQUID-COOLED COOLING APPARATUS, ELECTRONICS RACK AND METHODS OF FABRICATION THEREOF |
摘要 |
<p>Liquid-cooled electronics racks and methods of fabrication are provided wherein a liquid-based cooling apparatus facilitates cooling of electronic subsystems when docked within the electronics rack. The cooling apparatus includes a liquid-cooled cooling structure mounted to a front of the rack, and a plurality of heat transfer elements. The cooling structure is a thermally conductive material which has a coolant-carrying channel for facilitating coolant flow through the structure. Each heat transfer element couples to one or more heat-generating components of a respective electronic subsystem, physically contacts the cooling structure when that electronic subsystem is docked within the rack, and provides a thermal transport path from the heat-generating components of the electronic subsystem to the liquid-cooled cooling structure. Advantageously, electronic subsystems may be docked within or undocked from the electronics rack without affecting flow of coolant through the liquid-cooled cooling structure.</p> |
申请公布号 |
CA2743110(A1) |
申请公布日期 |
2010.12.16 |
申请号 |
CA20102743110 |
申请日期 |
2010.05.11 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
SIMONS, ROBERT;CAMPBELL, LEVI;CHU, RICHARD;IYENGAR, MADHUSUDAN;ELLSWORTH, MICHAEL, JR. |
分类号 |
H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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