| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device for securing reliability when applied with a current. <P>SOLUTION: The semiconductor device 11 includes a semiconductor substrate 12 where IGBTs having a plurality of IGBT cells, and FWDs 14 having a plurality of FWD cells arranged so as to be dispersed with the IGBs interposed therebetween are arranged side by side. Wire bonding regions 16 are arranged in positions corresponding to the FWDs 14 at one surface side of the semiconductor substrate 12. <P>COPYRIGHT: (C)2011,JPO&INPIT |
