发明名称 RESIN COMPOSITION FOR BONDED MAGNET, AND MOLDING USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a resin composition for a bonded magnet which exhibits excellent physical characteristics such as tensile strength and elongation even under severe temperature conditions without deteriorating magnetic characteristics, and to provide a molding molded by using the resin composition for a bonded magnet improved in heat resistance. <P>SOLUTION: The resin composition for the bonded magnet is formed of at least magnetic powder, binder resin, and an iodine compound. A content of the iodine compound is 0.1-3.50 wt.% as iodine with respect to the binder resin. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010283301(A) 申请公布日期 2010.12.16
申请号 JP20090137606 申请日期 2009.06.08
申请人 TODA KOGYO CORP 发明人 SAKURAI HIROMITSU;ARAKI TAKAHIRO;FUJII YASUHIKO
分类号 H01F1/113;C08K3/10;C08K3/16;C08L101/00;H01F1/08 主分类号 H01F1/113
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