发明名称 SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus and method, capable of efficiently cooling an already-processed wafer, and capable of striking a balance between contradictory requirements of high throughput and space saving. SOLUTION: The semiconductor manufacturing apparatus includes a processing chamber for processing a plurality of substrates and a substrate holder for transporting the plurality of substrates into the processing chamber and holding the plurality of substrates. The substrate holder has a holding section for mounting thereon the plurality of already-processed substrates and a plurality of substrates not to be processed yet between the plurality of already-processed substrate. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010283178(A) 申请公布日期 2010.12.16
申请号 JP20090135683 申请日期 2009.06.05
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 UENO MASAAKI
分类号 H01L21/683 主分类号 H01L21/683
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