SOLDER BONDING DEVICE, SOLDER BONDING PART, SOLDER BONDING METHOD, AND METHOD OF MANUFACTURING PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a solder bonding device, a solder bonding part and a solder bonding method that suppress occurrence of a bridge defect or icicle defect between adjacent electrodes when an electronic component having an electrode lead is mounted on a printed wiring board by soldering the electronic component to a through hole electrode of the printed wiring board, and to provide a method of manufacturing printed wiring board. SOLUTION: A heating device 11 selectively heats solder 1 supplied to the through hole electrode 7 to delay solidification of the supplied solder 1. Consequently, occurrence of a bridge defect or icicle defect between adjacent electrode leads 6 can be suppressed. COPYRIGHT: (C)2011,JPO&INPIT