POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE

摘要

Provided is a composition of a polyamide resin containing metaxylene groups, the composition comprising a polyamide (A) constituted of diamine units including 1,3-bis(aminomethyl)cyclohexane units and dicarboxylic acid units and at least an aromatic secondary amine compound (B) or a phenolic antioxidant (D), the composition having a coefficient of oxygen permeability at 23ºC and 75% RH of 1.5 cc·mm/m2·day·atm or lower. This composition hence has excellent gas-barrier properties and resistance to thermal deterioration.