发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HIGH LEAD COUNT AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: forming a leadframe with a tiebar and an outer lead having an outer lead outer pad; forming an inner lead on a peel strip; attaching the leadframe to the peel strip around the inner lead; wire bonding a die to the outer lead and the inner lead; encapsulating the die and portions of the outer lead and the inner lead; removing the peel strip to expose a bottom surface of the inner lead; and removing the leadframe to have the outer lead outer pad of the outer lead coplanar with the bottom surface of the inner lead.
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申请公布号 |
US2010314731(A1) |
申请公布日期 |
2010.12.16 |
申请号 |
US20090484245 |
申请日期 |
2009.06.14 |
申请人 |
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发明人 |
CAMACHO ZIGMUND RAMIREZ;BATHAN HENRY DESCALZO;DAHILIG FREDERICK RODRIGUEZ |
分类号 |
H01L23/495;H01L21/56 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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