| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit that improve the flexibility of arrangement of external devices without making wiring complicated. <P>SOLUTION: The semiconductor integrated circuit is connected to the plurality of external devices. The semiconductor device includes a cell portion, a plurality of IO circuits 102, and a plurality of bonding pads 103. The cell portion exhibits functions of the semiconductor integrated device. The IO circuits 102 are provided according to the respective external devices, and control connection with the cell portion 101. Each of the bonding pads 103 can be connected to two IO circuits 102, and has a first terminal 201a for connection with one IO circuit 102a and a second terminal 201a for connection with the other IO circuit 102b. <P>COPYRIGHT: (C)2011,JPO&INPIT |
