| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a resin composition that gives a cured product of high thermal conductivity and has small shrinkage when cured. <P>SOLUTION: This thermosetting resin composition includes a polyfunctional (meth)acrylate (a), a filler (b) of high thermal conductivity and a curing agent (c), wherein the content of the filler (b) of high thermal conductivity is 800-1,600 pts.mass on the basis of 100 pts.mass of the polyfunctional (meth)acrylate (a). <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
