发明名称 LOCAL HEATING APPARATUS
摘要 PROBLEM TO BE SOLVED: To solve the problem that when the edge part of a substrate is heat-treated, a part of a substrate supporting member protrudes from the substrate to support the substrate or since the substrate supporting member is interfered physically and contacted with a substrate edge part vicinal member of a substrate alignment mechanism or the like, the edge part of the substrate can not be heat-treated. SOLUTION: When the edge part of the substrate is heat-treated by a heating means, the coordinates of the heating means and those of the substrate supporting member are position-controlled independently to shift the center position of the heating means from that of the substrate supporting member. The substrate supporting member is set at a position to be not interfered physically with a substrate peripheral member and the heating means is set close to the edge part of the substrate to perform heating process. As a result, the position close to the edge part of the substrate can be heat-treated. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010282045(A) 申请公布日期 2010.12.16
申请号 JP20090135884 申请日期 2009.06.05
申请人 SHARP CORP 发明人 UEDA KAZUHIKO
分类号 G02B5/20;B05C5/00;B05C9/14 主分类号 G02B5/20
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