| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyamide resin composition excellent in conductivity, a gas-barrier property and heat-resistance. <P>SOLUTION: The polyamide resin composition includes a polyamide (A) obtained by polycondensing a diaminediamine component containing ≥30 mol% of metaxylylenediamine and optionally containing para-xylylene and a dicarboxylic acid component optionally containing isophthalic acid in a 4-20C α,ω-linear chain aliphatic dicarboxylic acid such as adipic acid and sebacic acid, and a conductive substance (B), and has a volume resistivity of 10<SP>5</SP>Ω cm or less. <P>COPYRIGHT: (C)2011,JPO&INPIT |
