| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer circuit board including, as a cable part, a build-up layer by connection using a conductive projection. SOLUTION: In the method of manufacturing the multilayer circuit board in which a circuit base material having a metal foil having the conductive projection erected on at least one surface and an insulating resin layer laminated on the one surface of the metal foil and fixed in a state wherein the conductive projection penetrates it is laminated with another circuit member, and circuit layers are connected by the conductive projection, the insulating resin layer having a multilayer structure is formed on the one surface of the metal foil by coating and drying resins, layer by layer, to be formed only on the one surface of the metal foil and the top surface of the conductive projection, or one layer of the insulating resin layer is composed of polyamic acid as a polyimide precursor during lamination and imidization is performed after the lamination to form a polyimide resin layer. COPYRIGHT: (C)2011,JPO&INPIT |
