摘要 |
PROBLEM TO BE SOLVED: To solve the problem associated with a method for conducting a heat-treatment of a film formed on a surface of a substrate without raising the temperature of a rear surface of the substrate, such as a method of instantly contacting and subsequently releasing a heated solid with large heat capacity, e.g. by rotating a heated roller on the substrate so as to achieve line contact, wherein uniform, reproducible heat-treatment of a large-area substrate cannot be performed because uniform thermal contact between the substrate and a supporting stand cannot be achieved due to warpage of the substrate or dust on the substrate. SOLUTION: A pressure-adhesive material is inserted between the supporting stand and the substrate so as to enable uniform, reproducible thermal contact therebetween. This enables the heat-treatment for firing the coating film formed on a bendable sheet-like resin substrate by contacting a rotating heated roller with the film. COPYRIGHT: (C)2011,JPO&INPIT
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