发明名称 LAYERED BODY AND METHOD FOR MANUFACTURING THIN SUBSTRATE USING THE LAYERED BODY
摘要 Provided is a layered body (1) including a substrate (2) to be ground and a support, (5) where the substrate may be ground to a very small (thin) thickness and can then be separated from the support without damaging the substrate. One embodiment is a layered body including a substrate to be ground, a joining layer (3) having a curable acrylate polymer and a curable acrylate adhesion modifying agent in contact with the substrate to be ground, a photothermal conversion layer (4) having a light absorbing agent and a heat decomposable resin, and a light transmitting support. After grinding the substrate surface which is opposite that in contact with the joining layer, the layered body is irradiated through the light transmitting layer and the photothermal conversion layer decomposes to separate the substrate and the light transmitting support.
申请公布号 WO2010025047(A3) 申请公布日期 2010.12.16
申请号 WO2009US53999 申请日期 2009.08.17
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 LARSON, ERIC, G.;WEBB, RICHARD, J.;KROPP, MICHAEL, A.
分类号 H01L21/68;H01L21/304 主分类号 H01L21/68
代理机构 代理人
主权项
地址