| 摘要 |
The present invention provides a silane compound which can be preferably used in an electronics application and the like, as a resin composition which is excellent in heat resistance, pressure resistance, water resistance, low moisture absorption property, low dielectric property, mechanical and chemical stability, and heat conductivity and capable of forming cured articles which hardly reduce physical properties even under severe environments such as high temperature and high pressure and high humidity; its production method, and a resin composition containing the silane compound. The silane compound of the present invention provides a silane compound having a siloxane bond and an imido bond, wherein the silane compound comprises a structure unit formed by connecting at least one organic skeleton having an imido bond to a silicon atom forming a siloxane bond, wherein the silane compound is defined by the following average composition formula: XaYbZcSiOd in the formula, X may be same or different and denotes a group including an organic skeleton having an imido bond, represented by the following formula (1); Z may be same or different and denotes an organic group having no imido bond; Y may be same or different and denotes at least one selected from the group consisting of hydrogen atom, hydroxyl group, halogen atom, and OR group; R may be same or different and denotes at least one selected from the group consisting of alkyl, acyl, aryl, and unsaturated aliphatic residual groups and may have a substituent; a is a numeral of 3 or lower but not 0; b is 0 or a numeral less than 3; c is 0 or a numeral less than 3; d is a numeral less than 2 but not 0; and a+b+c+2d=4, in the formula, R1 denotes at least one structure selected from the group consisting of aromatic, heterocyclic, and alicyclic rings; x and z may be same or different and independently denote an integer of 0 or higher and 5 or lower; and y is 0 or 1. |
