| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the cost by making a core substrate common and to improve flexibility of wiring design by increasing wiring density. <P>SOLUTION: A wiring board 30 includes the core substrate 10 having a structure in which a number of linear conductors 12 are closely provided penetrating an insulating base 11 along its thickness. On both surfaces of the core substrate 10, pads P1, P2 comprising parts of a wiring layer 22 having both ends electrically connected sharing a plurality of linear conductors 12 are arranged opposite each other, and wiring connections with one surface side and the other surface side of the core substrate 10 are formed through the pads. Further, an insulating base 11 is made of an inorganic dielectric, and pads P3, P4 which include parts of wiring layers 22 each electrically connected to only one end side of linear conductors 12 for each group of a plurality of linear conductors 12 are arranged on both surfaces of the core substrate 10. <P>COPYRIGHT: (C)2011,JPO&INPIT |
