| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting module which achieves high luminance light emission as well as reduced weight and dimensions, and a method for manufacturing the same. <P>SOLUTION: In the semiconductor light emitting module (101), a convex (202) serving as a reflecting member is formed on a metal thin plate (102) so as to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) and a printed board (103) are connected, for example, with a wire (201). The convex (202) is formed, for example, to surround the circumference of the element by pressing and bending the metal thin plate (102) from the rear face, and to be higher than the semiconductor light emitting element (104). <P>COPYRIGHT: (C)2011,JPO&INPIT |
