| 摘要 |
PROBLEM TO BE SOLVED: To uniformly grind a semiconductor wafer to an extremely thin thickness by sticking a hard member to the semiconductor wafer, and to easily peel the hard member from the semiconductor wafer without damaging the semiconductor wafer. SOLUTION: The double-sided adhesive sheet 10 includes adhesive surfaces 13A and 14A on front and rear surfaces. In the double-sided adhesive sheet 10, a circuit surface side of the semiconductor wafer W is adhered to the hard member P in order to grind an opposite surface of the circuit surface of the semiconductor wafer W. The double-sided adhesive sheet 10 includes an outer edge having an identical shape with a circuit side plane part WA of the semiconductor wafer W, and a weak adhesive region 16 is formed at the outer edge side of the adhesive surface 14A. COPYRIGHT: (C)2011,JPO&INPIT |
