发明名称 |
METHOD OF FORMING WIRE BONDS IN SEMICONDUCTOR DEVICES |
摘要 |
A method of forming a wire bond in a semiconductor device includes forming a first bump of a first composition proximate to a probe mark on a bond pad. A second bump of the first composition is formed adjacent to the first bump such that the first and second bumps are formed away from the probe mark. A wire of a second composition that is harder than the first composition is attached on top of the first and second bumps to form an interconnection. |
申请公布号 |
US2010314754(A1) |
申请公布日期 |
2010.12.16 |
申请号 |
US20090510274 |
申请日期 |
2009.07.28 |
申请人 |
FREESCALE SEMICONDUCTOR, INC. |
发明人 |
ZHANG CHANGLIANG;JIANG YINGWEI;WANG ZHIJIE;XIAO WEI |
分类号 |
H01L23/498;H01L21/768 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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