| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that is more inexpensive than before with conventional normal general module constitution, and secures bonding reliability of a solder bonding part. SOLUTION: This invention relates to the method of manufacturing the semiconductor device, including: a circuit board P formed by bonding metal plates to both surfaces of an insulating substrate; one semiconductor element bonded to an external surface of one metal plate through first solder; and a base plate for heat dissipation, bonded to an external surface of the other metal plate through second solder. The method includes steps of: manufacturing the circuit board P in such a way that the ratio (a) of the sum t<SB>M</SB>of plate thicknesses of both metal plates M1, M2 to the plate thickness t<SB>C</SB>of the insulating substrate C falls within a predetermined range for securing durability of solder H1 and solder H2 which are lead-free solder of the same kind, to temperature stress; and carrying out, under an identical heating condition, processing for bonding the semiconductors S, S' to the external surface of one metal plate M1 of the circuit board P through the first solder H1 concurrently with processing for bonding the base plate B to the external surface of the other metal plate M2 through the second solder H2. COPYRIGHT: (C)2011,JPO&INPIT |
