发明名称 Low-temperature co-fired ceramic material and multilayer wiring board using the same
摘要 <p>Objects of the present invention are to provide a low-temperature co-fired ceramic material having a coefficient of linear thermal expansion controlled and has a high dielectric constant, and to reduce the warpage of a fired product even if it has an unsymmetrical lamination structure in a multilayer wiring board in which glass-ceramic mixed layers of different compositions are laminated. A low-temperature co-fired ceramic material in accordance with the present invention includes: SiO 2 - B 2 O 3 - Al 2 O 3 - alkaline earth metal oxide based glass, alumina, titania, and cordierite; glass, titania, and cordierite; or glass, titania, and mullite. When a multilayer wiring board is made of the low-temperature co-fired ceramic material, the content of cordierite or mullite of the substrate material is adjusted to control a difference in a coefficient of linear thermal expansion between the layers of the substrate material to not more than 0.25 × 10 -6 /°C.</p>
申请公布号 EP1612194(B1) 申请公布日期 2010.12.15
申请号 EP20050013812 申请日期 2005.06.27
申请人 TDK CORPORATION 发明人 MIYAUCHI, YASUHARU;ARASHI, TOMOHIRO
分类号 C03C14/00;C03C3/091;C03C4/16;H01L23/15;H01L23/498;H05K1/03 主分类号 C03C14/00
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