发明名称 DIP SOLDERING APPARATUS
摘要 PURPOSE: A soldering device is provided to easily match a soldering point and monitor the normality of soldering, thereby reducing the rate of soldering failure. CONSTITUTION: A soldering device comprises a solder bath(24), a solder melting unit, and a molten solder side gush-out unit. The solder bath is fixed to a base(10). The solder melting unit melts solder kept in the solder bath. The molten solder side gush-out unit including a molten solder pumping part and a molten solder guide part gushes out molten solder in the molten solder bath to a side above the surface of molten solder.
申请公布号 KR20100131137(A) 申请公布日期 2010.12.15
申请号 KR20090049878 申请日期 2009.06.05
申请人 IDON CO., LTD. 发明人 KANG, SANG IL
分类号 B23K3/08;H01L21/60;H05K3/34 主分类号 B23K3/08
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