发明名称 LAPPING APPARATUS
摘要 The invention is to provide a method for making heated plane (34, 34', 42) of cooler (30, 30', 40) obtain better flatness and roughness. First, grinder (10) and fixture (20), with grinding plate (11), are provided. Then, the cooler (30, 30', 40) is arranged onto the fixture (20). Next, abrasive (132) is injected into the gap between the grinding plate (11) and the heated plane (34, 34', 42), making the fixture (20) press and clamp the cooler (30, 30', 40) in a way, such that the heated plane (34, 34', 42) of the cooler (30, 30', 40) contacts the abrasive (132) closely. Finally, the grinding plate (11) is rotated to make at least one grinding process to the heated plane (34, 34', 42), making the heated plane (34, 34', 42) obtain a surface with better roughness and flatness, further enhancing the contact tightness between the heated plane (34, 34', 42) and a heating element, and therefore promoting the thermally conductive efficiency between the cooler (30, 30', 40) and the heating element.
申请公布号 EP2260977(A1) 申请公布日期 2010.12.15
申请号 EP20090007778 申请日期 2009.06.12
申请人 CPUMATE INC.;GOLDEN SUN NEWS TECHNIQUES CO., LTD. 发明人 LIN, KUO-LEN;LIN, CHEN-HSIANG;LIU, JUI-HO;HSU, KEN;CHENG, CHIH-HUNG
分类号 B24B37/04;H05K7/20 主分类号 B24B37/04
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