发明名称 Crimp bump interconnection
摘要 <p>The invention relates to a first integrated electronic component for an integrated electronic apparatus. The first integrated electronic component (100) comprises a male body (102) with a protrusion element (103), e.g. a bump. The protrusion element (103) comprises a protrusion connection section (104). The protrusion element (103) protrudes from the male body (102) in such a way that the protrusion connection section (104) is adapted for being mechanically connectable to a corresponding connection recess (202) of a female electrical conductive body (201), e.g. a conductive layer, of the second integrated electronic component (200).</p>
申请公布号 EP2261965(A1) 申请公布日期 2010.12.15
申请号 EP20090162632 申请日期 2009.06.12
申请人 NXP B.V. 发明人 PISCHLER, ERICH
分类号 H01L21/60;H01L23/485;H01L23/498 主分类号 H01L21/60
代理机构 代理人
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