发明名称 |
VERFAHREN ZUR KONTAKTIERUNG EINES DRAHTLEITERS GELEGT AUF EIN SUBSTRAT |
摘要 |
<p>Method for bonding a wire conductor arranged on a preferably card-like substrate 1 during the manufacture of a transponder unit T having a wire coil 3 and a chip module 5, comprising a first phase, wherein the coil 3 is permanently joined with the substrate, and a second phase, wherein the wire conductor and the chip module 5 are bonded, whereas in the first phase at least one of the end portions 4 of the wire conductor intended for later bonding with the chip module is attached to the substrate with a free loop 9 being formed, and that the loop 9 thus formed is gripped in a second phase and a section of the loop 9 is then bonded with a bonding area 6 of the chip module 5 and attached to it in an electrically conductive manner.</p> |
申请公布号 |
AT488816(T) |
申请公布日期 |
2010.12.15 |
申请号 |
AT20070018301T |
申请日期 |
2007.09.18 |
申请人 |
HID GLOBAL IRELAND TEORANTA |
发明人 |
O'KEEFFE, SEAMUS;MORLEY, BRENDAN |
分类号 |
G06K19/077;B23K20/00;B23K20/10;H01L21/60 |
主分类号 |
G06K19/077 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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