发明名称 |
Implant system with a temporary implant and method for influencing the corrosion rate of an implant |
摘要 |
<p>The method involves performing selective control of a solution or stabilization of a medical implant (2) after implantation of the implant, where the implant is made of a metallic, biocompatible and bio-corrodible material. A voltage- or current source (4) is provided outside of a body of a patient, and electrodes (3) i.e. adhesive electrodes, and/or an electrically conductive connection is applied at or in a body tissue (5) of the patient. The electrodes and/or the electrically conductive connection are connected with the implant directly or by the body tissue. An independent claim is also included for a device for influencing corrosion rate of an implant.</p> |
申请公布号 |
EP2260883(A2) |
申请公布日期 |
2010.12.15 |
申请号 |
EP20100160054 |
申请日期 |
2010.04.15 |
申请人 |
HELLER, JORG |
发明人 |
HELLER, JOERG;DR. SIEBER, IRINA;OBERHAUSER, SIMON |
分类号 |
A61L31/02;A61B17/68;A61L31/14;A61N1/00 |
主分类号 |
A61L31/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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