发明名称 Implant system with a temporary implant and method for influencing the corrosion rate of an implant
摘要 <p>The method involves performing selective control of a solution or stabilization of a medical implant (2) after implantation of the implant, where the implant is made of a metallic, biocompatible and bio-corrodible material. A voltage- or current source (4) is provided outside of a body of a patient, and electrodes (3) i.e. adhesive electrodes, and/or an electrically conductive connection is applied at or in a body tissue (5) of the patient. The electrodes and/or the electrically conductive connection are connected with the implant directly or by the body tissue. An independent claim is also included for a device for influencing corrosion rate of an implant.</p>
申请公布号 EP2260883(A2) 申请公布日期 2010.12.15
申请号 EP20100160054 申请日期 2010.04.15
申请人 HELLER, JORG 发明人 HELLER, JOERG;DR. SIEBER, IRINA;OBERHAUSER, SIMON
分类号 A61L31/02;A61B17/68;A61L31/14;A61N1/00 主分类号 A61L31/02
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