发明名称 SENSORPAKET
摘要 A sensor package includes a lead frame with a first portion extending and a second portion extending in a direction inclined with respect to the first potion. The sensor package also includes an application specific integrated circuit and a magneto resistive sensor and a ferrite provided with a molding body.
申请公布号 AT490474(T) 申请公布日期 2010.12.15
申请号 AT20080710010T 申请日期 2008.02.13
申请人 NXP B.V. 发明人 HESEN, PAULUS;GROENHUIS, ROELF;BOSCH, JOHANNES
分类号 G01R33/09;H01L21/56;H01L27/22 主分类号 G01R33/09
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