发明名称 |
SENSORPAKET |
摘要 |
A sensor package includes a lead frame with a first portion extending and a second portion extending in a direction inclined with respect to the first potion. The sensor package also includes an application specific integrated circuit and a magneto resistive sensor and a ferrite provided with a molding body. |
申请公布号 |
AT490474(T) |
申请公布日期 |
2010.12.15 |
申请号 |
AT20080710010T |
申请日期 |
2008.02.13 |
申请人 |
NXP B.V. |
发明人 |
HESEN, PAULUS;GROENHUIS, ROELF;BOSCH, JOHANNES |
分类号 |
G01R33/09;H01L21/56;H01L27/22 |
主分类号 |
G01R33/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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