PROCESS FOR PREPARING A POLYMERIC RELIEF STRUCTURE

摘要

The invention relates to a process for the preparation of a polymeric relief structure comprising the steps
a) coating a substrate with a coating composition comprising one or more radiation-sensitive ingredients,
b) locally treating the coated substrate with electromagnetic radiation having a periodic, non periodic or random radiation-intensity pattern, forming a latent image,
c) polymerizing and/or crosslinking the resulting coated substrate,
wherein the coating composition comprises a compound A comprising at least one radiation curable group and having a transition temperature between 30 °C and 120 °C and a photoinitiator. The invention also relates to polymeric relief structures having a high aspect ratio despite a very thin coated layer.