发明名称 WAFER FLAT ZONE ALIGNER WHICH INCLUDES FUNCTION OF EDGE CRACK DETECTOR AND OPERATING METHOD THEREOF
摘要 PURPOSE: A wafer flat zone aligner including an edge crack detecting function and a driving method of the same are provided to simultaneously perform a flat zone align operation and an edge crack detecting operation by splitting one laser using a beam splitter. CONSTITUTION: A beam splitter(4) splits laser from laser source into two lasers. A first optical system(2) horizontally radiates first laser split from the beam splitter to the surface of a wafer along a first path. A second optical system(3) radiates second laser split from the beam splitter to the surface of the wafer along a second path. A first optical sensor(9) detects a first laser transmitted through the float zone of the wafer. A second optical sensor(14) detects the second laser transmitted through the edge crack of the wafer.
申请公布号 KR20100131275(A) 申请公布日期 2010.12.15
申请号 KR20090050082 申请日期 2009.06.05
申请人 KOREA POLYTECHNIC UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION;NANOTEK INC. 发明人 CHA, DONG HO;NAM, YUN SEOK
分类号 H01L21/68 主分类号 H01L21/68
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