发明名称 |
WAFER FLAT ZONE ALIGNER WHICH INCLUDES FUNCTION OF EDGE CRACK DETECTOR AND OPERATING METHOD THEREOF |
摘要 |
PURPOSE: A wafer flat zone aligner including an edge crack detecting function and a driving method of the same are provided to simultaneously perform a flat zone align operation and an edge crack detecting operation by splitting one laser using a beam splitter. CONSTITUTION: A beam splitter(4) splits laser from laser source into two lasers. A first optical system(2) horizontally radiates first laser split from the beam splitter to the surface of a wafer along a first path. A second optical system(3) radiates second laser split from the beam splitter to the surface of the wafer along a second path. A first optical sensor(9) detects a first laser transmitted through the float zone of the wafer. A second optical sensor(14) detects the second laser transmitted through the edge crack of the wafer.
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申请公布号 |
KR20100131275(A) |
申请公布日期 |
2010.12.15 |
申请号 |
KR20090050082 |
申请日期 |
2009.06.05 |
申请人 |
KOREA POLYTECHNIC UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION;NANOTEK INC. |
发明人 |
CHA, DONG HO;NAM, YUN SEOK |
分类号 |
H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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