| 摘要 |
There is provided a camera module (50), having an outer surface, which comprises a sensor die (2), a glass plate (7), peripheral spacer (6), and an optical element (9), where the profile of said outer surface has a shoulder (51) extending around said outer surface in a direction parallel to the plane of said sensor die (2), and said outer surface is at least partially covered by a deposited metal layer (24,32). There is also provided a method of manufacturing a camera module, which comprises the steps of providing an assembly comprising a sensor dice wafer, a spacer wafer and an optical element wafer, said spacer wafer being placed in front of said sensor dice wafer and said optical element wafer being placed in front of said spacer wafer, sawing a top cut, using a first saw blade of a first thickness, proceeding in a direction from said optical element wafer toward said sensor dice wafer, stopping before said sensor dice wafer is reached, and sawing a bottom cut, using a second saw blade of a second thickness, proceeding in a direction from said sensor dice wafer toward said optical element wafer. |
