| 摘要 |
<p>A chip carrier for contacting with a chip and an antenna is disposed on an antenna substrate. The chip carrier features a carrier substrate having a chip contact arrangement located at a distance from longitudinal ends of the carrier substrate for electrical contacting with a chip. The carrier substrate includes two antenna contact surfaces having the chip contact arrangement therebetween for electrical contacting with the antenna. The chip contact arrangement and the antenna contact surfaces are located on an application surface of the chip carrier. At least one insulation surface-is formed on the application surface between the chip contact arrangement and the antenna contact surfaces.</p> |
