发明名称 |
PACKAGING FOR MICRO ELECTRO-MECHANICAL SYSTEMS AND METHODS OF FABRICATING THEREOF |
摘要 |
Embodiments of the present disclosure provide systems and methods for producing micro electro-mechanical device packages. Briefly described, in architecture, one embodiment of the system, among others, includes a micro electro-mechanical device formed on a substrate layer; and a thermally decomposable sacrificial structure protecting at least a portion of the micro electro-mechanical device, where the sacrificial structure is formed on the substrate layer and surrounds a gas cavity enclosing an active surface of the micro electro-mechanical device. Other systems and methods are also provided. |
申请公布号 |
EP1758814(A4) |
申请公布日期 |
2010.12.15 |
申请号 |
EP20050725682 |
申请日期 |
2005.03.15 |
申请人 |
GEORGIA TECH RESEARCH CORPORATION |
发明人 |
KOHL, PAUL, A.;AYAZI, FARROKH;JOSEPH, PAUL JAYACHANDRAN |
分类号 |
B81B7/00;B81C1/00;B81C99/00 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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