ADHESIVE BONDING SHEET, SEMICONDUCTOR DEVICE USING THE SAME, AND METHOD FOR MANUFACTURING SUCH SEMICONDUCTOR DEVICE

摘要

AN ADHESIVE SHEET HAVING AN OPTICALLY TRANSPARENT SUBSTRATE AND AN ADHESIVE LAYER, THIS ADHESIVE SHEET BEING USED IN BOTH A DICING STEP AND A SEMICONDUCTOR ELEMENT STICKING STEP, THE ADHESIVE LAYER COMPRISING: A POLYMER COMPONENT (A) HAVING A WEIGHT AVERAGE MOLECULAR WEIGHT OF 100,000 OR MORE INCLUDING FUNCTIONAL GROUPS; AN EPOXY RESIN (B); A PHENOLIC EPOXY RESIN CURING AGENT (C); A PHOTOREACTIVE MONOMER (D), WHEREIN THE TG OF THE CURED MATERIAL OBTAINED BY ULTRAVIOLET LIGHT IRRADIATION IS 250°C OR MORE; AND A PHOTOINITIATOR (E) WHICH GENERATES A BASE AND RADICALS BY IRRADIATION WITH ULTRAVIOLET LIGHT OF WAVELENGTH 200-450NM.