| 摘要 |
<p>PURPOSE: A semiconductor device is provided to simplify the layout design of a via contact by preventing the short circuit between a small pattern and a large pattern. CONSTITUTION: An I-shape opening is formed inside a second pattern(410_2). A first pattern(410_1) is arranged at the center of an opening of a second pattern which surrounds the first pattern. A via contact(420) is connected to the first pattern. A third pattern(400) is connected to the via contact.</p> |
