Three-dimensional integrated circuit i.e. three-dimensional network-on-chip circuit, for use in stack of semiconductor substrates, has through-silicon-vias for connecting asynchronous serializers to corresponding asynchronous deserializers

摘要

The circuit has levels (L1, L2) comprising logical block elements (10, 12) that are communicated with one another, and an asynchronous communication structure provided with three through-silicon-vias (18, 28) for connecting asynchronous serializers (16, 26) to corresponding asynchronous deserializers (20, 30). The levels comprise respective semiconductor substrates on which are formed interconnection stacks, respectively. The vias have ends that are connected to metallic strips formed in upper parts of the interconnection stacks, respectively.