| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning agent for a silicon wafer, for improving a cleaning process, in which pattern collapse tends to be induced, in a method of manufacturing the silicon wafer having a fine pattern of projections and recesses on the surface. SOLUTION: The cleaning agent for a silicon wafer contains, at least an aqueous cleaning liquid and a water-repellent cleaning liquid for providing at least recessed portions in the pattern of projections and recesses with water repellence during a cleaning process. The water-repellent cleaning liquid contains a mixture of a water-repellent compound which contains a hydrophobic group and a reactive moiety that is chemically bondable with Si of a silicon wafer, and an organic solvent that contains at least an alcohol solvent. COPYRIGHT: (C)2011,JPO&INPIT
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