| 摘要 |
A semiconductor device is provided with an electrode pad; and a lower layer arranged under the electrode pad. The electrode pad includes a slit section, penetrating a whole thickness of the electrode pad from a higher surface to a lower surface in contact with the lower layer; a contact start region, arranged in the higher surface, on which a probe makes a contact; and an inspection region, arranged in the higher surface, on which the probe makes an inspection upon the semiconductor. The slit section includes a first group of aperture open to the inspection region; a second group of aperture open to the contact start region smaller than the first group of aperture; and a vacant region able to store a part of shavings produced by the probe while shifting from the contact start region to the inspection region, by grinding the higher surface of the electrode pad.
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