| 摘要 |
A high frequency switch module includes a laminated circuit component that includes an antenna electrode connected to a single antenna, a plurality of communication electrodes connected to a plurality of high frequency communication circuits to transmit, receive, or transmit and receive plural kinds of communication signals, and a land arranged to mount a switch IC on, and a switch IC that is mounted on the laminated circuit component and includes a common terminal connected to the single antenna through the laminated circuit component, and a plurality of communication circuit terminals connected to the plurality of high frequency communication circuits through the laminated circuit component. The switch IC is provided with switch circuits between the communication circuit terminals and the common terminal, and all of the switch circuits have the same or substantially the same resistance against transmission power applied at the time of transmission.
|
