| 摘要 |
Electrical components, e.g., a radiator for a cell phone circuit, are manufactured by a method comprising the steps of: (A) providing a substrate, e.g., a polymeric film, having a first facial side that has a metal coating, e.g., copper, and a second facial side that does not have a metal coating; (B) applying a covering material that is impervious to etching and plating, e.g., solder-mask, to the metal coating to define a trace except for its contact spot; (C) applying etch-resist to the metal coating to define the contact spot; (D) etching the metal coating from the substrate that is not covered by the covering material or etch-resist; (E) removing the etch-resist from the metal coating; and (F) plating the uncovered metal coating with a plating material comprising at least one of silver, gold, and nickel. |
