发明名称 BONDING METHOD AND BONDED STRUCTURE
摘要 A bonding method includes: preparing a first base material and a second base material to be bonded to each other via a bonding film; forming a liquid coating by supplying a polyester-modified silicone material-containing liquid material onto at least one of the first base material and the second base material, the polyester-modified silicone material being a product of dehydrocondensation reaction between a polyester resin obtained by esterification reaction of trimethylolpropane with terephthalic acid and a silicone material that has a branched polyorganosiloxane backbone having a unit structure represented by chemical formula (1) below at a branched portion, a unit structure represented by at least one of chemical formulae (2) and (3) below at a linking portion, and a unit structure represented by at least one of chemical formulae (4) and (5) below at a terminal portion, wherein R1 each independently represents a methyl group or a phenyl group, and X represents a siloxane residue; drying and/or curing the liquid coating to obtain the bonding film on at least one of the first base material and the second base material; contacting a plasma to the bonding film to develop adhesion near a surface of the bonding film; and contacting the first base material and the second base material via the bonding film developing adhesion, so as to obtain a bonded structure in which the first base material and the second base material are bonded to each other via the bonding film.
申请公布号 US2010304156(A1) 申请公布日期 2010.12.02
申请号 US20100778556 申请日期 2010.05.12
申请人 SEIKO EPSON CORPORATION 发明人 SATO MITSURU;YAMAMOTO TAKATOSHI;NAITO NOBUHIRO;IMAMURA MINEHIRO
分类号 B32B37/12;B32B9/04 主分类号 B32B37/12
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