METHOD FOR MANUFACTURING PREPREG FOR PRINTED WIRING BOARD AND DEVICE FOR MANUFACTURING PREPREG FOR PRINTED WIRING BOARD

摘要

Provided are a method for manufacturing a prepreg for a printed wiring board and a device for manufacturing a prepreg for a printed wiring board, which are capable of controlling the thickness of a resin film on both surfaces of the prepreg and achieving good productivity without bubbles remaining in the prepreg. Specifically provided is a method for manufacturing a prepreg for a printed wiring board, the method comprising a step for carrying an elongated base material sheet (3) in the longitudinal direction thereof and continuously coating both surfaces of the base material sheet (3) with resin liquid (4), wherein after one surface of the base material sheet (3) is coated while the base material sheet (3) is bent by being pressed by the coating tip (2) of a first coating device (1a), the other surface of the base material sheet (3) is coated while the base material sheet (3) is bent by being pressed by the coating tip (2) of a second coating device (1b). Die coaters or roll coaters can be used as the first coating device (1a) and the second coating device (1b).