| 发明名称 |
ADHESIVE SHEET FOR CONNECTING CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
<p>Disclosed is an adhesive sheet for connecting a circuit member, which comprises a supporting base and an adhesive layer that is provided on the supporting base and composed of an adhesive composition. The adhesive composition contains (A) a high molecular weight component having a weight average molecular weight of not less than 100,000, (B) an epoxy resin, (C) a phenolic epoxy resin curing agent, (D) a radiation polymerizable compound, (E) a photoinitiator and (F) a curing accelerator.</p> |
| 申请公布号 |
WO2010137443(A1) |
申请公布日期 |
2010.12.02 |
| 申请号 |
WO2010JP57604 |
申请日期 |
2010.04.28 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD.;OOKUBO KEISUKE;NAGAI AKIRA |
发明人 |
OOKUBO KEISUKE;NAGAI AKIRA |
| 分类号 |
H01L21/60;C09J7/02;C09J11/06;C09J133/00;C09J163/00;C09J201/00;H01L21/301;H01L21/304;H01L21/56;H01L23/29;H01L23/31 |
主分类号 |
H01L21/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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