| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus for mounting an electronic component which reduces the number of components and reduces cost, and a method of manufacturing the same. <P>SOLUTION: The apparatus 100 for mounting the electronic component includes a housing at least a portion of which is constituted by a resin molding 110 and an electronic component 120 which is mounted in the housing. The electronic component 120 is embedded in the resin molding 110 while an electrode 121 of the electronic component 120 is exposed. Wiring 130 is electrically connected with the exposed electrode 121. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
