发明名称 SEALING APPARATUS FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a structure capable of easily moving a work from the inside of a vacuum heating chamber to the inside of an inert gas filled chamber in a sealing apparatus for an electronic component. SOLUTION: The electronic component sealing apparatus includes the vacuum heating chamber 2, the inert gas filled chamber 3, an inner door arranged between the vacuum heating chamber 2 and the inert gas filled chamber 3, and a mounting board 24 for mounting a magazine rack 13. The inner door is composed of a first inner door 12 and a second inner door 23, and the first inner door 12 has a support 12A. When both the first and second inner doors 12, 23 are opened, the support 12A is abutted on a portion of the second inner door 23 which is opened with an end part of the mounting board 24 as a fulcrum 24A, wherein the portion is separated from the fulcrum 24A, so that the mounting board 24 and the second inner door 23 form one plane approximately continued on the portion of the fulcrum 24A. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010272780(A) 申请公布日期 2010.12.02
申请号 JP20090124921 申请日期 2009.05.25
申请人 NIPPON AVIONICS CO LTD 发明人 SHINTAKU NAOKI
分类号 H01L23/02 主分类号 H01L23/02
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