| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor capable of using a sealing material, which is liquid or gel at a normal temperature, for transfer molding, and to provide a method of manufacturing a semiconductor device by using the resin composition. SOLUTION: The resin composition for sealing the semiconductor comprises a cooled solidified body of the resin composition, which is liquid or gel at a normal temperature, to be used in the transfer molding. Then, in the method of manufacturing the semiconductor device using a transfer molding machine, the resin composition is supplied into the pot of a die for transfer molding while maintaining the cooled solidified state. Then, after thawing the supplied resin composition inside the pot, the thawed liquid or gel-like resin composition is compressed and extruded from the inside of the pot by a plunger and thus it is made to flow into a cavity. By resin-sealing a semiconductor element inside the cavity by the resin composition which is made to flow in, the semiconductor device is manufactured. COPYRIGHT: (C)2011,JPO&INPIT
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