| 摘要 |
PROBLEM TO BE SOLVED: To provide a two-layer flexible substrate less in degradation of adhesion strength between an insulating film and a copper layer even in thermal history received under a manufacturing process of a flexible substrate, particularly a two-layer flexible substrate suitable for fine pattern formation and COF mounting, and to provide a method for manufacturing the two-layer flexible substrate. SOLUTION: The two-layer flexible substrate has a metal layer formed on at least one side of an insulator film without using an adhesive, and the copper layer formed on the surface of the metal layer. The metal layer comprises a first metal layer formed on the surface of the insulating film, and a second metal layer formed on the surface of the first metal layer. The second metal layer comprises a Cu-Mn alloy containing Mn at 1-11 wt.% and Cu for the rest, and has a layer thickness of 80-350 nm. COPYRIGHT: (C)2011,JPO&INPIT
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