发明名称 PATTERN EXPOSURE METHOD, CONDUCTIVE FILM PRODUCING METHOD, AND CONDUCTIVE FILM
摘要 There are provided a pattern exposure method, a conductive film producing method, and a conductive film, wherein a photosensitive material is subjected to a proximity exposure through a photomask disposed with a proximity gap of 70 to 200μm, and thereby is exposed in the mask pattern periodically in the conveying direction to obtain a conductive film. The conductive film has a plurality of conductive portions of first and second conductive thin metal wires and a plurality of opening portions. A side of each thin metal wire has a protrusion extending toward the opening portion from a virtual line representing a designed width of the thin metal wire, and the protruding amount of the protrusion is 1/25 to 1/6 of the designed width.
申请公布号 US2010300729(A1) 申请公布日期 2010.12.02
申请号 US20100790378 申请日期 2010.05.28
申请人 FUJIFILM CORPORATION 发明人 MATSUDA TOYOMI;SUTOU MAKOTO;BABA TOMONORI;MITSUHASHI DAISUKE
分类号 H01B5/14;G03F7/20 主分类号 H01B5/14
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