LIGHT-EMITTING DIODE PACKAGE AND BACKLIGHT UNIT

摘要

The present invention relates to an LED package and backlight unit, having excellent heat dissipation characteristics and light-emitting efficiency. The present invention relates to an LED package and backlight unit, comprising: a first pad; a second pad electrically separated from the first pad; a first chip which is mounted on the first pad and electrically connected to the first pad and the second pad, and which emits light; a molding unit fixing the first pad and the second pad, and having a support surface; a first lead electrically connected to the first pad and located outside the molding unit, and having a first surface; and a second lead electrically connected to the second pad, separated from the first lead, located outside the molding unit, and having a second surface parallel to the first surface. The sum of the area of the first surface of the first lead and the area of the second surface of the second lead is 30% or more of the area of the support surface.