| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component which observes no overshoot when starting to apply load, observes no fluctuation while applying predetermined load, is stable in the load for a long term and can secure excellent packaging quality. <P>SOLUTION: An apparatus 110 for mounting an electronic component pushes the electronic component P carried at the tip of a nozzle 117 against a circuit board S for mounting the electronic component P on the circuit board S. Before the electronic component P is mounted on the circuit board S, expected load applied to the tip of the nozzle 117 during the mounting is measured. When the electronic component P is mounted on the circuit board S, driving of the nozzle 117 (currents respectively supplied to a first motor and a second motor, in concrete) is adjusted by a correction amount corresponding to a difference between the measured value of the expected load and a target value of the expected load so that the expected load reaches the target value. <P>COPYRIGHT: (C)2011,JPO&INPIT |
