| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting board and a semiconductor device which adapt to densification and function enhancement which further rise. SOLUTION: After semiconductor elements and chip components are mounted on the bendable mounting board, a bending side part of the mounting board is bent at 90°to assemble one solid body of the cubic or cuboid semiconductor device. Thereafter, these are connected in three-dimensionally free combination to form the semiconductor device, so that it is possible to provide the mounting board and the semiconductor device which adapt to densification and function enhancement which further rise. COPYRIGHT: (C)2011,JPO&INPIT |
